Electronics giant Samsung has approved the spending of some USD 850 million for its unit in Vietnam to manufacture flip-chip ball grid arrays (FC-BGA), according to KBS News.
FC-BGA is a highly-integrated package board used to connect a high-integration semiconductor chip to a main board.
The company will spend the investment in phases until 2023 to build a new FC-BGA production line.
Under the plan, the Vietnamese subsidiary will focus on producing FC-BGA while Samsung's factories in the Republic of Korea will specialise in technology development and high-end products.
Samsung plans to invest USD850 mln in Vietnam subsidiary
Electronics giant Samsung has approved the spending of some 850 million USD for its unit in Vietnam to manufacture flip-chip ball grid arrays (FC-BGA), according to KBS News.
Source: VNA
